JPH064522Y2 - ヒュ−ズエレメント - Google Patents
ヒュ−ズエレメントInfo
- Publication number
- JPH064522Y2 JPH064522Y2 JP1985201078U JP20107885U JPH064522Y2 JP H064522 Y2 JPH064522 Y2 JP H064522Y2 JP 1985201078 U JP1985201078 U JP 1985201078U JP 20107885 U JP20107885 U JP 20107885U JP H064522 Y2 JPH064522 Y2 JP H064522Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- metal powder
- fuse element
- fuse
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 238000002844 melting Methods 0.000 claims description 36
- 230000008018 melting Effects 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 7
- 229910020922 Sn-Pb Inorganic materials 0.000 description 7
- 229910008783 Sn—Pb Inorganic materials 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000748 compression moulding Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002801 charged material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000009702 powder compression Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985201078U JPH064522Y2 (ja) | 1985-12-25 | 1985-12-25 | ヒュ−ズエレメント |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985201078U JPH064522Y2 (ja) | 1985-12-25 | 1985-12-25 | ヒュ−ズエレメント |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62107347U JPS62107347U (en]) | 1987-07-09 |
| JPH064522Y2 true JPH064522Y2 (ja) | 1994-02-02 |
Family
ID=31164192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985201078U Expired - Lifetime JPH064522Y2 (ja) | 1985-12-25 | 1985-12-25 | ヒュ−ズエレメント |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064522Y2 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6756490B2 (ja) * | 2016-02-19 | 2020-09-16 | デクセリアルズ株式会社 | 電流ヒューズ |
| KR102819127B1 (ko) | 2020-03-31 | 2025-06-12 | 주식회사 엘지에너지솔루션 | 이종금속으로 이루어진 hv 버스 바 및 이의 제조 방법 |
| KR102773242B1 (ko) * | 2020-04-07 | 2025-02-27 | 주식회사 엘지에너지솔루션 | 이종금속으로 이루어진 전극 리드 및 이의 제조 방법 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540924U (en]) * | 1978-09-09 | 1980-03-15 |
-
1985
- 1985-12-25 JP JP1985201078U patent/JPH064522Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62107347U (en]) | 1987-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0233751A2 (en) | Fuse for electronic component | |
| JP4033331B2 (ja) | サーミスタおよびその製造方法 | |
| DE60120522T2 (de) | Kindersicherheitssitz | |
| US4006443A (en) | Composition resistor with an integral thermal fuse | |
| US5999085A (en) | Surface mounted four terminal resistor | |
| US7064648B2 (en) | Alloy type thermal fuse and material for a thermal fuse element | |
| JPH05279649A (ja) | 機械的及び電気的な接触を形成させるための方法及び組成物 | |
| EP0064824B1 (en) | Thermal fuse | |
| JPH064522Y2 (ja) | ヒュ−ズエレメント | |
| JP2001176374A (ja) | 焼結体ヒューズおよびそれを用いた固体電解コンデンサ | |
| US7199697B2 (en) | Alloy type thermal fuse and material for a thermal fuse element | |
| JPH073559Y2 (ja) | 感温スイッチ | |
| US6515572B2 (en) | Circuit arrangement comprising an SMD-component, in particular a temperature sensor, and a method of manufacturing a temperature sensor | |
| EP1424713B1 (en) | Alloy type thermal fuse and material for a thermal fuse element | |
| JPH0723863Y2 (ja) | 温度ヒューズ | |
| CA2368337C (en) | Thermistor and method of manufacture | |
| EP0061550A2 (en) | Glass coated disk thermistor | |
| JPH0616471B2 (ja) | ヒユ−ズ機構内蔵型固体電解コンデンサ | |
| JPS58142505A (ja) | 過負荷溶断形抵抗器 | |
| JPH0539546Y2 (en]) | ||
| JPS63308840A (ja) | 電子部品用ヒュ−ズ | |
| JPS598231A (ja) | 温度ヒユ−ズ | |
| JP2000090792A (ja) | 合金型温度ヒュ−ズ | |
| JP4212400B2 (ja) | 温度ヒューズ | |
| JPH0222919Y2 (en]) |